Towards High-Throughput and Low-Cost SoC Integration: A Case Study of Scalable Wrapper Designs on FPGAs

Yang, Xiaokun2020-04-212020-04-212018X. Yang, L. Wu, H. He, etc., "Towards High-Throughput and Low-Cost SoC Integration: A Case Study of Scalable Wrapper Designs on FPGAs," IET Computers & Digital Techniques (CDT - IF: 0.589), Under Review, 2018.https://hdl.handle.net/10657.1/2280en-USTowards High-Throughput and Low-Cost SoC Integration: A Case Study of Scalable Wrapper Designs on FPGAsArticle