Towards High-Throughput and Low-Cost SoC Integration: A Case Study of Scalable Wrapper Designs on FPGAs
Date
2018
Authors
Yang, Xiaokun
Journal Title
Journal ISSN
Volume Title
Publisher
IET Computers & Digital Techniques
Abstract
Description
Keywords
Citation
X. Yang, L. Wu, H. He, etc., "Towards High-Throughput and Low-Cost SoC Integration: A Case Study of Scalable Wrapper Designs on FPGAs," IET Computers & Digital Techniques (CDT - IF: 0.589), Under Review, 2018.