Towards High-Throughput and Low-Cost SoC Integration: A Case Study of Scalable Wrapper Designs on FPGAs

Date

2018

Authors

Yang, Xiaokun

Journal Title

Journal ISSN

Volume Title

Publisher

IET Computers & Digital Techniques

Abstract

Description

Keywords

Citation

X. Yang, L. Wu, H. He, etc., "Towards High-Throughput and Low-Cost SoC Integration: A Case Study of Scalable Wrapper Designs on FPGAs," IET Computers & Digital Techniques (CDT - IF: 0.589), Under Review, 2018.